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Subject: high density rigid flex PCB for FC, COB, MCM, CSP

Date: 10/10/03 at 5:36 AM
Posted by: Frank Bose
E-mail: frank.bose@gspag.ch
Message Posted:

GS Praezions AG has been in business for 23 years to produce high density flex and rigid flex circuit boards with microvias for chip on board (COB), chip on flex (COF), multichip module (MCM) and chip scale packaging (CSP) applications.

Fine lines and vias down to 2 mil are possible. We have all types of surface finishes including those for Al and Au wire bonding.

We are located in Switzerland and would be delighted to supply you with high quality premium Swiss rigid flex circuit boards.

Best regards,
Dr. Frank Bose
Director


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