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Subject: Re: silicon and gold bonding

Date: 03/29/02 at 2:01 PM
Posted by: A.N.Chandorkar
E-mail: anc@ee.iitb.ac.in
Message Posted:

In Reply to: Re: silicon and gold bonding posted by Jacques Jonsmann on 08/16/00 at 12:58 AM:

Try this:
Deposit Si-Ge preform on gold plated wafers and anneal at 380 degree centigrade.


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