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Subject: Laminated Substrates for MEMS devices
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Date: 10/10/03 at 5:41 AM
Posted by: Frank Bose
GS Praezions AG has been in business for 23 years to produce high density flex and rigid flex circuit boards with microvias for chip on board (COB), chip on flex (COF), multichip module (MCM) and chip scale packaging (CSP) applications.
Fine lines and vias down to 2 mil are possible. We have all types of surface finishes including those for Al and Au wire bonding.
We also make substrates and packaging for sensors.
We are located in Switzerland and would be delighted to supply you with high quality premium Swiss rigid flex circuit boards.
Dr. Frank Bose
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