[ List Subjects ][ Post Message ]
[ View Followups ][ Post Followup ]

Date: 06/21/03 at 10:55 AM
Posted by: Sisira Gamage
E-mail: nidahas@aol.com

Please pass me any advice regarding following.

I am trying to bond two Silicon wafers together using Au-Si eutectic. I use a Ti barrier layer of 3500 A with 5000 A of Au. I patteren the Au layer prior bonding. standrad KI, for Au and Hydrogen Peroxide for Ti. clean the Au layer with oxygen plasma. I remove the oxide layer from the other Silicon surface before bonding. I didn't see problems bonding on to unpatterend Au this way. Any thoughts on what I am doing wrong here?

Thank you,
Sisira

Follow Ups:

  Re: Au -Si bonds michael cohn   Posted at: 11/04/03 (0)

Post a Follow-up:

Name:
E-Mail:
Subject:

Message to Post: