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Subject: Au -Si bonds
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Date: 06/21/03 at 10:55 AM
Posted by: Sisira Gamage
Please pass me any advice regarding following.
I am trying to bond two Silicon wafers together using Au-Si eutectic. I use a Ti barrier layer of 3500 A with 5000 A of Au. I patteren the Au layer prior bonding. standrad KI, for Au and Hydrogen Peroxide for Ti. clean the Au layer with oxygen plasma. I remove the oxide layer from the other Silicon surface before bonding. I didn't see problems bonding on to unpatterend Au this way. Any thoughts on what I am doing wrong here?
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