| Home | Terms of Use | Site Map | Contact Us |
IndustryCommunity.com > Electrical and Electronic Community > Micro-Electro-Mechanical Systems Forum > Message
Main Menu
Find

[ List Subjects ][ Post Message ]
[ View Followups ][ Post Followup ]

Subject: Au -Si bonds

Date: 06/21/03 at 10:55 AM
Posted by: Sisira Gamage
E-mail: nidahas@aol.com
Message Posted:

Please pass me any advice regarding following.

I am trying to bond two Silicon wafers together using Au-Si eutectic. I use a Ti barrier layer of 3500 A with 5000 A of Au. I patteren the Au layer prior bonding. standrad KI, for Au and Hydrogen Peroxide for Ti. clean the Au layer with oxygen plasma. I remove the oxide layer from the other Silicon surface before bonding. I didn't see problems bonding on to unpatterend Au this way. Any thoughts on what I am doing wrong here?

Thank you,
Sisira



Follow Ups:


Post a Follow-up:

Name:
E-Mail:
Subject:

Message to Post:

 

1999-2001 Sunlit Technology Co., Ltd. All rights reserved.